Mokhoa oa ho khetha ka mahlale le ho sebelisa li-welders tsa polokelo ea matla ka nepo: Tataiso ea Qeto le Buka e sebetsang.

I. Sistimi ea Qeto ea Khetho ea Lisebelisoa
1. Tekolo ea Thepa (Basic Dimension)

Tlhahlobo ea Motlakase/Thermal Conductivity:

Lisebelisoa tse phahameng tsa conductivity (koporo / aluminium) li hloka mehlala e nang le matla a capacitor E kholo ho feta kapa e lekanang le 100kJ. Ka mohlala, tjheseletsa 0.3mm koporo foil hloka 150kJtjheseletsa ya polokelo ya matla.

Tekano e Kopanetsoeng ea Botenya:

Taba:Betri e ncha ea matla a tjheseletsa foil ea aluminium ea 0.1mm + 2mm theminale ea koporo e khethile mofuta oa 120kJ, e fihlelang bophara ba nugget ea Φ1.0±0.05mm.

2. Tlhahiso ea Tlhokahalo ea Mohlala (Economic Dimension)

Foromo ea Palo ea Bokhoni:

Nako ea ho khutlisa matsete a thepa (likhoeli)=(Litšenyehelo tsa lisebelisoa + 3-litšenyehelo tsa ho lokisa selemo) / (Phokotso ea litšenyehelo sebakeng se seng le se seng × Karolelano ea libaka tsa letsatsi le letsatsi × matsatsi a 22)

Ntlafatso ea Nako ea Nako ea Tlhahiso:

Ha sebaka sa weld spoting ke<3mm, a rotary electrode system is needed to increase welding speed to 120 spots/minute.

3. Tekolo ea Bokhoni ba Bafani (Lipontšo tsa Bohlokoa)

Mekhahlelo ea mantlha ea tekheniki:

Bophelo ba potoloho ea banka ea Capacitor E kholo ho feta kapa e lekana le li-cycle tse 500,000

Nako ea karabo ea tsamaiso ea khatello Ka tlase ho kapa e lekana le 3ms

Ho nepahala ha nako ea tsamaiso ea ho laola 0.01ms

Netefatso ea Bokhoni ba Ts'ebeletso:

Process database reserve >500 metsoako ea lintho tse bonahalang

Ho-nako ea karabo ea ho lokisa bothata<48 hours

II. Mekhoa ea Ts'ebetso ea Ts'ebeliso ea Lisebelisoa
1. Melao ea Khauta bakeng sa Boemo ba Parameter

Mehato e meraro- ea ho lokisa mathata:

① Litekanyetso tsa mantlha: Bala hona joale ho latela botenya ba thepa × 80A/mm²

② E ntle-Mohato oa Tokiso: Fetola nako ea ho tsoa ±0.2ms ka tlhahlobo ea metallographic

③ Mokhoa oa ho ntlafatsa: Hlahisa tlhahlobo e matla ea khanyetso ho notlela boleng bo nepahetseng ba khatello.

Likopano tse tloaelehileng tsa parameter:

2. Lintlha tsa Bohlokoa Tsa Tlhokomelo ea Letsatsi le Letsatsi

Kemiso ea Tlhokomelo ea Electrode:

Tlhokomelo ea Bophelo bo Botle ba Banka ea Capacitor:

Chelete ea khoeli le khoeli bakeng sa sekhahla sa ho bola ha capacitance (e lokela ho ba<3%/year) Quarterly insulation resistance test (≥100MΩ)

3. Thibelo le Taolo ea Kotsi ea Boleng

Lipontšo tsa Tlhokomelo ea Ts'ebetso:

Sekhahla sa phetoho e matla ea ho hanyetsa<5%

Taolo ea sehlopha sa mamello ea Nugget ± 8%

Mocheso-bophara ba sebaka se amehileng Ka tlase kapa ho lekana le 20% ea botenya ba thepa

Tlhōlisano e Tloaelehileng:

III. Tsela ea Ntlafatso ea Bohlale
1. Digital Twin System Construction

Theha mofuta oa welding o nang le likarolo tse 5000 tsa likarolo tsa ts'ebetso.

Kamora kopo ea k'hamphani ea likarolo tsa likoloi, nako e ncha ea ntlafatso ea ts'ebetso e ile ea fokotsoa ho tloha matsatsing a 14 ho isa matsatsing a 3.

2. Mokhoa oa ho ntlafatsa oa AI

E bolela esale pele motsoako o nepahetseng oa liparamente ka ho ithuta ho tebileng, ho nepahala Ho feta kapa ho lekana le 92%.

Moetsi oa sehokelo o fihletse phetoho ea othomathike ea welding, e fokotsa sekhahla sa sekoli ka 76%.

3. Ts'ebetso ea Remote ea IoT le Tlhokomelo

-phetiso ea nako ea 'nete ea data ea boemo ba sesebelisoa (sampling frequency 1kHz).

Ho hloleha ha karolo ea mantlha ho nepahala Ho feta kapa ho lekana le 85%.

IV. Mekhoa ea ho laola litšenyehelo
1. Full Life Cycle Cost Model

Foromo ea Palo:

LCC=Litšenyehelo tsa ho reka + (Tšebeliso ea matla × 0.8 CNY/kWh) + (Tšebeliso ea motlakase × Theko ea Unit) + Litšenyehelo tsa tlhokomelo

Taba e Tloaelehileng:Khampani ea lisebelisoa tsa lapeng e khethile mofuta oa 80kJ, e fokotsa kakaretso ea -litjeho tsa lilemo tse tharo ka 42% ha e bapisoa le thepa ea khale.

2. Moralo oa Ntlafatso ea Tšebeliso ea Matla

Sebelisa lisebelisoa tsa motlakase tsa GaN ho eketsa katleho ea phetoho ho 93%.

Kenya ts'ebetso e phahameng-kemiso ea litheko tsa tlhahiso ea motlakase phuleng, ho fokotsa litšenyehelo tsa matla ka 28%.

3. Spare Parts Management Innovation

Theha letamo la thepa le arolelanoang bakeng sa likarolo tsa bohlokoa (li-capacitor / GBT modules).

Sekhahla sa thekiso ea thepa se eketsehile ka 300%, ho lula ha letlole ho fokotsehile ka 60%.

Qetello
Ho khetha ka mahlale atjheseletsa ya polokelo ya matlae hloka hore ho thehoe-mohlala oa qeto ea "material-mesebetsi{2}}ea moruo", e shebaneng le lintlha tsa mantlha tse kang ho nepahala ha tlhahiso ea matla a thepa (±1%) le lebelo la ho arabela khatello (Ka tlase kapa ho lekana le 3ms). Tšebeliso e nepahetseng e hloka ho aha-tsamaiso e koetsoeng ea loop system bakeng sa ho lokisa paramethara, tlhahlobo ea tšebetso, le tlhokomelo e bohlale. Lintlha li bonts'a hore ts'ebeliso e tloaelehileng ea li-welders tsa polokelo ea matla e ka tsitsisa sekhahla sa ho feta sa welding ka holimo ho 99.95% le ho eketsa katleho ea lisebelisoa (OEE) ho isa ho 89%. Ka ts'ebeliso e tebileng ea mafahla a dijithale le li-algorithms tsa AI, moloko o mocha oa ba bohlaleli-welders tsa polokelo ea matlae tla fihlela tsoelopele-ea pele ea "-mekhahlelo ea ho itlhahisa, -boleng ba ho ikahlola, le{3}}ho itlhahloba liphoso." Ho kgothaletswa hore dikgwebo di thehe laeborari ya thepa ya dijithale bakeng sa ditshebetso tsa ho tjheseletsa le ho tsetela 3-5% ya boleng ba thepa selemo le selemo ho ditjhelete tsa phetoho e bohlale ho tswelapele ho fumana meputso ya thekenoloji. Tlas'a mekhoa e 'meli{10}ea khabone, likhoebo tse tsebang hantle bohlokoa ba theknoloji ea ho tjheseletsa polokelo ea matla li tla fumana molemo o moholo oa 15% -25% lefapheng la tlhahiso ea maemo a holimo.

Ikopanye hona joale